COB Specialty Components On United Resin, Inc.

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COB Systems are a series of single component, high performance, flow control and encapsulating applications for the semiconductor industry.

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Specification Chart

Specification Chart

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COB SYSTEMS	VISCOSITY CPS @ 72 ºF	GLASS TRANSITION (TG) ºC	CTE PPM/ °C	HALOGEN FREE	CURE SCHEDULE HOURS @ 125 °C	VOLUME RESISTIVITY PER ASTM D257	SURFACE RESISTIVITY PER ASTM D257	DISSIPATION FACTOR PER ASTM D150	DIELECTRIC CONSTANT PER ASTM D149 (1 kHz)
Epoxy Dam Control	Paste	180	39.0	Yes	6	2.1 x 10¹⁴	2.09 x 10¹⁴	0.0092	4.94
Epoxy Fill System	80,000	175	39.5	Yes	6	2.6 x 10¹⁴	2.89 x 10¹⁴	0.0081	5.02
Low Profile Glop Top	195,000	155	28	Yes	2	1.79 x 10¹⁴	2.18 x 10¹⁴	0.0087	4.97
High Profile Glop Top	940,000	177	39.1	Yes	2	1.9 x 10¹⁴	2.39 x 10¹⁴	0.0087	4.97
Low Chlorine Encapsulant	63,000	150	28.0	Yes	3	1.9 x 10¹⁴	2.39 x 10¹⁴	0.0087	4.97